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| Datasheet File OCR Text: |
| 8 PIN SOIC/SOIN PACKAGE OUTLINE 3 D e 8 H SEE DETAIL "A" 0.25 3 E1 E GAUGE PLANE L 5 INDEX AREA (D/2 X E1/2) 1 2 8X b 2 4 4 c L1 0-8 TOP VIEW END VIEW DETAIL "A" (SCALE: 3/1) C A2 A SEATING PLANE A1 ccc C SIDE VIEW 3-D VIEW Min A A1 A2 D E E1 L L1 b c e ccc Notes: 0.31 0.17 1.35 0.10 1.25 4.80 5.80 3.80 0.40 Nominal 4.90 6.00 3.90 1.05 REF 1.27 BSC - Max 1.75 0.25 1.65 5.00 6.20 4.00 0.90 0.51 0.25 0.10 Remarks Overall Package Height Standoff Package Body Thickness "X" Body Size Lead Span "Y" Body Size Lead Foot Length Lead Length Lead Width Lead Thickness Lead Pitch Coplanarity 1. All dimensions are in millimeters. 2. True position spread tolerance of each lead is 0.125mm at maximum material condition. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Maximum mold flash, protrusions or gate burrs is 0.15mm per end. Dimension "E1" does not include inter-lead flash or protrusion. Maximum inter-lead flash or protrusion is 0.25mm per side. Dimensions "D" & "E1" are determined at the datum plane "H". 4. Dimensions "b" and "c" apply to the flat section of the lead between 0.10 to 0.25mm from the lead tip. 5. Details of pin 1 identifier are optional, but must be located within the index area indicated. 6. Provided for reference only - contact your SMSC Regional Sales Office for latest information. 80 Arkay Drive Hauppauge, NY 11788 (631) 435-6000 FAX (631) 273-3123 Rev. 8/23/05 |
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